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Bayern
Ausschreibung
200 mm Wafer Prober with Temperature Testing (IIS-05.1), Bayern - Frist 07.09.2026
Procurement of one wafer probing system capable of handling 200 mm and 300 mm wafers, equipped with temperature testing, a darkened DUT chamber, non‑magnetic chuck, and remote control interfaces for sensor IC and chiplet characterization at Fraunhofer IIS.
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Leistungsbeschreibung
Procurement of one wafer probing system capable of handling 200 mm and 300 mm wafers, equipped with temperature testing, a darkened DUT chamber, non‑magnetic chuck, and remote control interfaces for sensor IC and chiplet characterization at Fraunhofer IIS.
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Keywords
fraunhofer iismagnetic sensorsoptical sensorssensor ictemperature testingwafer prober
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