Ausführung
Hessen
Ausschreibung
Flip Chip Die Bonder with precision bonding, ultrasonic and UV curing modules, Hessen - Frist 22.09.2026
The contract is for the supply of a flip‑chip die bonder equipped with precision face‑up and face‑down bonding, ultrasonic and UV‑curing capabilities, tool‑tip heating, in‑situ video monitoring and dispensing modules.
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Leistungsbeschreibung
The contract is for the supply of a flip‑chip die bonder equipped with precision face‑up and face‑down bonding, ultrasonic and UV‑curing capabilities, tool‑tip heating, in‑situ video monitoring and dispensing modules.
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Keywords
die bonderflip chipprecision bondingultrasonicuv curing
Id: b6549133-b186-4933-9b59-6a369995f00e