Ausführung
Bayern
Ausschreibung
Wafer‑ and Frame‑Prober System for Post‑Silicon IC Testing, Bayern - Frist 07.09.2026
The procurement concerns a wafer‑prober system capable of handling 200 mm and 300 mm wafers as well as wafers on dicing frames, to be used for post‑silicon verification, characterization and functional testing of integrated circuits and chiplets at Fraunhofer EMFT, integrated with an automated test system.
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Leistungsbeschreibung
The procurement concerns a wafer‑prober system capable of handling 200 mm and 300 mm wafers as well as wafers on dicing frames, to be used for post‑silicon verification, characterization and functional testing of integrated circuits and chiplets at Fraunhofer EMFT, integrated with an automated test system.
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Keywords
automated test systemframeproberintegrated circuitspost-silicon testingwaferprober
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